LPKF CuttingMaster Series
Laser substrate cutting machine - carbonization-free also possible
We can propose solutions to the following requirements in electronic circuit board manufacturing. Requirement 1: Miniaturization => Solution: The distance between mounted components or patterns and cutting lines can be reduced. Requirement 2: Eliminate impact during board separation. => Solution: Laser board separation is a non-contact process, so it does not impart shock to the workpiece. Regarding thermal shock, it does not exceed reflow temperatures. Requirement 3: Suppression of cutting debris => Solution: In laser cutting, cutting debris is sublimated and collected by a dust collector, minimizing debris. Other advantages of laser cutting: Features of the Laser Board Separation Machine CuttingMaster Series No carbonization Relaxation of cutting shape and mounted component layout restrictions Flexibility in editing cutting lines Reduction in material costs (layout size > 30% reduction) Automation compatibility is also possible (supports SMEMA, OPC-UA) If you need further information, please feel free to contact us.
- Company：ブルックスジャパン 福岡本社、東京支店
- Price：Other
